Automatic Dispenser Machine

Description

Function and use

1.Common application areas include: automotive machinery parts coating, mobile phone button gluing, mobile phone battery packaging, laptop battery packaging, groove glue dispensing, PCB board bonding sealing, IC sealing, speaker outer ring gluing, PDA sealing, LCD Sealing, IC packaging, IC bonding, chassis bonding, optical instrument processing, mechanical sealing, etc.

2.Applicable fluid: silica gel, EMI conductive adhesive, UV adhesive, AB adhesive, quick-drying adhesive, epoxy adhesive, sealant, hot glue, grease, silver glue, red glue, solder paste, thermal grease, solder mask, Transparent paint, screw fixing agent, etc.

3.Main application: bonding, filling, coating, sealing, filling, dripping, linear/arc/round coating in product process.

4.Other requirements: In order to improve the productivity,  efficiency and the competitive advantage of the enterprise’s production, our company can add other equipment according to the process requirements.

*** can be made according to customer requirements

Technical Specification:

  1. Dimensions (length * width * height): ≤ 750 * 730 * 800 (mm).
  2. XY working stroke: 500*400 (mm), Z working stroke: 100 (mm).
  3. Repeat positioning accuracy: ±0.3mm.
  4. Working voltage: 220V/50Hz.
  5. Working pressure: greater than 0.5Mpa.
  6. Machine efficiency approx.: According to product evaluation.
  7. Equipment weight: ~100kg.